(Hong Kong)
Product Summary
Features
The major features of the MPC826xA family are as follows:
1.Dual-issue integer core
2.Separate power supply for internal logic and for I/O
3.Separate PLLs for G2 core and for the CPM
4.64-bit data and 32-bit address 60x bus
5.32-bit data and 18-bit address local bus
6.60x-to-PCI bridge (MPC8265 and MPC8266 only)
7.System interface unit (SIU)
8.Twelve-bank memory controller
9.CPU core can be disabled and the device can be used in slave mode to an external core
10.Communications processor module (CPM)
11.CPM
12.CPM multiplexing
13.TC layer (MPC8264 and MPC8266 only)
14.PCI bridge (MPC8265 and MPC8266 only)
Diagrams
<IMG border=0 src="http://www.seekic.com/uploadfile/ic-mfg/201273231842517.jpg">
| Image | Part No | Mfg | Description |  |
Pricing (USD) |
Quantity | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
 XPC8260ZUHFBC |
Freescale Semiconductor |
Microprocessors (MPU) POWERQUICC II HIP3 REV C |
Data Sheet |
Negotiable |
|
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| Image | Part No | Mfg | Description | |
Pricing (USD) |
Quantity | ||||||
 |
XPC823CVR66B2T |
|
IC MPU POWERQUICC 66MHZ 256-PBGA |
Data Sheet |
Negotiable |
|
||||||
|
XPC823CZT66B2T |
|
IC MPU POWERQUICC 66MHZ 256-PBGA |
Data Sheet |
Negotiable |
|
||||||
|
XPC823ECVR66B2 |
Freescale Semiconductor |
Microprocessors (MPU) 823E PB-FREE |
Data Sheet |
Negotiable |
|
||||||
|
XPC823EVR66B2 |
Freescale Semiconductor |
Microprocessors (MPU) PB-FREE 823E 66MHZ |
Data Sheet |
Negotiable |
|
||||||
|
XPC823EVR75B2 |
Freescale Semiconductor |
Microprocessors (MPU) PB-FREE 823E 75MHZ |
Data Sheet |
Negotiable |
|
||||||
|
XPC823VR66B2T |
|
IC MPU POWERQUICC 66MHZ 256-PBGA |
Data Sheet |
|
|
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